| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation sheet superior in high heat resistance, low thermal expansion property, a dielectric property, a laser workability and flame retardant property. SOLUTION: This insulation sheet is used for forming an insulating layer in a printed circuit board, and obtained by flowing, extending and applying varnish containing a resin composite containing a cyanate resin and/or its pre-polymer, an epoxy resin substantially not containing a halogen atom, imidazol compound, an inorganic filler, and a solvent on one face or both faces of an insulating base material, by removing the solvent by heat-drying, and by forming into a film. COPYRIGHT: (C)2005,JPO&NCIPI
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