发明名称 |
Signal line circuit device |
摘要 |
A signal line circuit device is disposed on top of a mounting substrate. The signal line circuit device comprises a dielectric layer, a signal line formed on one surface of the dielectric layer, and a spacer (formed from a solder or a photo solder resist), which is formed between the mounting substrate and the dielectric layer, and generates a space separation between the signal line and the mounting substrate.
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申请公布号 |
US2005168304(A1) |
申请公布日期 |
2005.08.04 |
申请号 |
US20050045936 |
申请日期 |
2005.01.28 |
申请人 |
YAMAGUCHI TAKESHI;IMAOKA TOSHIKAZU |
发明人 |
YAMAGUCHI TAKESHI;IMAOKA TOSHIKAZU |
分类号 |
H01P3/08;H05K1/02;H05K1/14;H05K3/22;H05K3/28;H05K3/34;(IPC1-7):H01P3/08 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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