METHODS OF AND LASER SYSTEMS FOR LINK PROCESSING USING LASERPULSES WITH SPECIALLY TAILORED POWER PROFILES

摘要

A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link . The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the lase r pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciabl e damage to the substrate and passivation structure material located on either side of and underlying the links.