| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a leadless package which is miniaturized, is made thin, which can decrease the electric resistance between a semiconductor chip and a lead, and reduce the number of manufacturing man-hour; and also to provide a method for manufacturing the package. <P>SOLUTION: A plurality of semiconductor chips include a first lead frame connected electrodes provided on one surfaces of the plurality of semiconductor chips arranged in a plane, a second lead frame connected to electrodes provided on the other surfaces of the semiconductor chips, and a seal resin filled in a region surrounded by the first and the second lead frames for sealing the plurality of semiconductor chips. The plurality of semiconductor chips are electrically connected to each other by at least one of the lead frames. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
