| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition which has high radiation sensitivity and development margin to form a favorable pattern even when the process time exceeds the optimum developing time in a developing process, and with which a pattern thin film having excellent adhesiveness can be easily formed, and to provide an interlayer insulating film of electronic parts and microlens. <P>SOLUTION: The radiation-sensitive resin composition contains: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing unsaturated compound, (a3) a maleimide monomer containing a hydroxyl group or a carboxyl group, and (a4) an unsaturated compound excluding (a1), (a2) and (a3); and [B] a 1,2-naphthoquinone diazide compound. The interlayer insulating film and the microlens are produced from the above composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
