| 摘要 |
PROBLEM TO BE SOLVED: To provide a porosity wiring board wherein, while holding the porous structure of an insulated substrate, the state of an inner wall after molding is made good, connection reliability is improved by a plating film in which interlayer connection by a via-hole is formed by a wet process, a via-hole connection failure, dielectric breakdown by migration, etc. are not caused, mechanical strength is superior, and low permitivity and a low dielectric dissipation factor are shown, and to provide an electronic component using the wiring board. SOLUTION: In a double-sided wiring board or a multilayer wiring board wherein at least one or more porous layers 300 are laminated, the porous layer 300 includes polyimide and high thermal resistance thermoplastic resin as a blend object. The porosity wiring board is characterized in that wiring between layers is connected through a plating film 11 formed in a through-hole or the via-hole 10. COPYRIGHT: (C)2005,JPO&NCIPI |
