发明名称 |
Wafer cleaning method and resulting wafer |
摘要 |
A method of removing organic particles from a registration mark on a semiconductor wafer. The method comprises providing a semiconductor wafer comprising at least one registration mark at least partially filled with organic particles. The at least one registration mark has a trench width from approximately 1.0 mum to approximately 3.0 mum. The semiconductor wafer is exposed to a cleaning solution comprising tetramethylammonium hydroxide and at least one surfactant, such as an acetylenic diol surfactant. The semiconductor wafer is exposed to an ultrasonic or megasonic vibrational energy. A semiconductor wafer previously subjected to a chemical mechanical planarization treatment and having a reduced amount of organic particles in a registration mark is also disclosed.
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申请公布号 |
US2005040443(A1) |
申请公布日期 |
2005.02.24 |
申请号 |
US20040927612 |
申请日期 |
2004.08.25 |
申请人 |
ANDREAS MICHAEL T.;MORGAN PAUL A. |
发明人 |
ANDREAS MICHAEL T.;MORGAN PAUL A. |
分类号 |
H01L23/544;(IPC1-7):H01L23/58 |
主分类号 |
H01L23/544 |
代理机构 |
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主权项 |
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地址 |
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