| 摘要 |
PURPOSE:To improve the reliability of wire bonding, by bonding a chip IC to a conductor layer on a substrate with wire, forming a glass layer for sealing these members, and performing solder printing, a mounting of other chip parts and reflow. CONSTITUTION:An IC2, which is provided on a substrate 1, is bonded with wire. Thereafter, a mainly powder-state low-melting-point glass is heated and fused by using an applying device, in which a heater is provided, up to 350-450 deg.C so that the performance of the IC2 is not impaired. The glass is applied adequately on the IC2 and wires 3... so as to cover the surface. The glass is slowly cooled and hard-hardened, and a glass layer 4 is formed. After the processes of solder printing, mounting of other chip parts, reflow and the like, a hybrid IC is completed. Thus the IC and the wires are sealed with the glass layer having the similar expansion coefficient as that of the substrate comprising ceramics, and wire breakdown can be prevented. The mechanical strength is improved with the glass layer. |
