| 摘要 |
PURPOSE:To obtain a semiconductor device, which can use gold eutectic group high-reliability die bonding, can stabilize the characteristics of a plurality of unit chips and can manufacture composite chips having a high added value and size thereof can be magnified, by mutually separating a plurality of the semiconductor chips and mounting the chips onto a single back plate. CONSTITUTION:A plurality of semiconductor chips 1 are isolated mutually, and set up onto a single back plate 7. Or a plurality of the semiconductor chips 1 are separated mutually and arranged, and connected mutually by a plurality of connecting members (bridge members) 9 fitted to the surfaces or side surfaces of a plurality of the semiconductor chips 1. Or a plurality of the semiconductor chips 1 are segregated mutually and disposed, and connected to a single heat-resistant resin board 16 extending in parallel with the surfaces of a plurality of the semiconductor chips 1. Accordingly, the problem of the warpage and cracking of the chips is solved, gold eutectic group die bonding, etc. having high reliability can be used, the characteristics of a plurality of the unit chips are stabilized easily, characteristics are improved and an output is increased, and an added value is enhanced. |
