| 摘要 |
PURPOSE:To mount a chip part with high integration by coating a terminal connecting section with a resin for a mask, sealing the chip part by a coating resin and removing the resin for the mask by a solvent not reacted with the coating resin. CONSTITUTION:Terminal connecting sections 2 for a substrate are coated previously by using a resin 4 for a mask different from a coating resin 5. A chip part 1 on the substrate 2 is sealed by employing the coating resin 5. The resin 5 is cured, and the resins 4 for the masks in the terminal connecting sections 3 for the substrate 2 are removed by using a water-soluble or alcohol group solvent not reacted with the resin 5 to expose the terminal connecting sections 3. Lead terminals 6 are soldered to the terminal connecting sections 3 from which the resins 4 for the masks are removed.
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