| 摘要 |
PURPOSE:To flatten the lower surface of a flip chip, and to reduce defective bonding in case of mounting onto a hydrid integrated circuit substrate by fixing a flip chip element to an inspection device, inspecting the operation of the chip element, heating a projecting electrode at a semi-melting temperature and bonding a nondefective flip chip element after inspection onto the substrate through down-face bonding. CONSTITUTION:Lower surfaces are formed to a hemispherical shape and dispersion is formed in height in projecting electrodes 2a, 2b for a flip chip IC 1. The flip chip is sucked by a vacuum chuck 3, and positioned and fixed onto an inspection substrate 4. The inspection substrate 4 is heated by a heater, and the projecting electrodes 2a, 2b for the flip chip are heated at a temperature of a semi-melting state. The operation of the chips IC 1 is inspected under the state, and only nondefectives are sucked by the vacuum chuck 3 again. Since the projecting electrodes are brought into contact with probe electrodes 5 once at that time, the dispersion of the lower surface of the chip is corrected. The chip IC l is mounted onto a ceramic substrate 8, and connected through face-down bonding. Accordingly, a hybrid integrated circuit can be constituted only by using nondefective chips IC.
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