Heat sink, EMI shield and controller module assembly for a portable radio transceiver

摘要

A controller module includes a cast module base having a central recess with a peripheral ledge. A cover plate is positioned in the recess and supported by the ledge. A flexible circuit is attached to the inside surface of the cover plate and includes two integral flexible circuit connectors. One connector protrudes through an opening in the side of the module base while the second connector wraps around an edge of the cover plate and is adhesively bonded to the outside surface of the cover plate. The flexible circuit includes a polyimide substrate with electrical circuit patterns disposed on opposite sides of the substrate. A polyimide cover layer is adhesively bonded over one electrical circuit pattern and the cover layer is then adhesively bonded to the inside surface of the cover plate. A solder resist layer is applied over portions of the other electrical circuit pattern leaving exposed areas for soldering and electrical contact. For heat sinking, the module base includes an aperture and a hole suitable for attaching the stud of an RF power transistor. A front cover includes a speaker which is temporarily held in place by a circumferential ridge. A rubber spacer is positioned between the underside of the module base and the speaker to securely hold the speaker in place.