| 摘要 |
PURPOSE:To prevent defective adhesion during bonding by preventing the deposition of substituted silver with a mixed aq. soln. contg. potassium phosphate and mercaptopyridine when silver is electrodeposited on copper-base stock. CONSTITUTION:This substitution inhibitor is made of a mixed aq. soln. contg. potassium phosphate and mercaptopyridine. When silver is electrodeposited on copper or copper alloy stock or copper plated stock, the substitution inhibitor is used so as to prevent the deposition of substituted silver. As a result, defective adhesion during the die or wire bonding of silicon IC chips is prevented and reliability is improved.
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