| 发明名称 |
METHOD OF TREATING PRINTED CIRCUIT BOARD |
| 摘要 |
In a process for making a printed circuit from an insulating substrate with a copper plated surface and plated through holes, the surface and through holes are plated with a thin nickel layer prior to further fabrication steps. |
| 申请公布号 |
JPS63122197(A) |
申请公布日期 |
1988.05.26 |
| 申请号 |
JP19870231254 |
申请日期 |
1987.09.17 |
| 申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
PIITAA BAAKOSU;ROORENSU MAATEIN BARUDOOFU;DEYUAN SEODOORU NATSUPU |
| 分类号 |
H05K1/09;H05K1/11;H05K3/06;H05K3/24;H05K3/38;H05K3/42 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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