发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To perform high-precision mounting with high efficiency, by providing the bottom surface of a resin seal layer with the recess of a guide for positioning, and fitting it on a protrusion for positioning formed on a printed board side. CONSTITUTION:An external lead 2 is bent up to the same level as the bottom surface of a resin seal layer 1, and a recess 3 for a guide is formed on the bottom of the resin seal layer. Mounting is performed by fitting the recess 3 of resin on a protrusion for positioning on a printed board 6. By arranging asymmetrically the recess 3 with respect to a central point, opposite direction mounting can be prevented.
申请公布号 JPS63152162(A) 申请公布日期 1988.06.24
申请号 JP19860300778 申请日期 1986.12.16
申请人 NEC CORP 发明人 KAMIOKA JUNJI
分类号 H01L23/28;H01L23/50;H05K3/30;H05K3/34 主分类号 H01L23/28
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