| 摘要 |
<p>PURPOSE:To obtain a pressure-sensitive adhesive sheet for bonding wafer useful for separating semiconductor wafers from small pieces, by coating the face of a substrate with pressure-sensitive adhesive containing an expanding agent. CONSTITUTION:A pressure-sensitive adhesive containing an expanding agent comprising a higher acid (derivative), silicone compound, epoxy compound, polyol compound, beta-diketo compound, phosphite, etc., is applied to the face of a substrate comprising a polymer film having a carboxyl group-containing compound as a polymer constituent unit such as preferably crosslinked polyolefin film, ethylene-methacrylic acid copolymer film, etc., to give the aimed pressure- sensitive adhesive sheet. Addition of a radiation polymerizable compound to the pressure-sensitive adhesive can reduce tack by irradiating the pressure- sensitive adhesive layer with radiation after cutting and separation of wafer.</p> |
