摘要 |
PURPOSE:To fix a semiconductor easily in a short time without applying large stress to the semiconductor by inserting a protrusion in a radiator plate into the hole of the semiconductor and holding and fastening the semiconductor between the radiator plate and an insulating plate. CONSTITUTION:A positioning recessed section 12 for a semiconductor 1 and a protruding section 11 protruding to the internal bottom of the recessed section 12 are formed to a radiator plate 2 so that the semiconductor 1 can be fixed stably, the protruding section 11 shaped to the radiator plate 2 is inserted into the hole 13 of the semiconductor 1 in the semiconductor 1 when an insulating plate 4 is coupled with the radiator plate 2 by screws 7, a protruding section 9 and the end surface of the semiconductor 1 are brought into contact and positioned, and one surface of the semiconductor 1 is engaged with the recessed section 12. The semiconductor 1 is fast stuck and fastened between the radiator plate 2 and the insulating plate 4 by clamping and fixing the screws 7. Accordingly, the semiconductor and the radiator plate can be fixed without applying large stress to the semiconductor while mounting work can be simplified, thus largely decreasing the mandays of mounting.
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