| 摘要 |
PURPOSE:To remove a stress concentration and to prevent a resin from cracking by eliminating a corner under a tab in which the resin is easily cracked. CONSTITUTION:A semiconductor element 1 is placed on a tab 2, leads 3 are formed at the side, and the while is molded with resin 4. In a semiconductor of such a structure, the tab 2 is formed in a rectangular parallelepiped, and the tab 2 is exposed at the side of a package perpendicularly crossed with the side of the package formed with the leads 3. Thus, since the corner under the tab in which a stress concentration occurs is eliminated, it can prevent the resin from cracking. |
