发明名称 MANUFACTURE OF LEAD FRAME
摘要 PURPOSE:To remove an internal distortion and to prevent lead terminals from going up and down by employing holding and punching steps to punch lead terminals from a bandlike metal plate. CONSTITUTION:A lead frame has lead terminals 1 and inner leads 4 extended from between frames 3 and 3 disposed oppositely toward a center. LEDs 5 are mounted at the leads 4, and connecting structures 8 are formed of fine metal wirings 6. In order to manufacture by a punching method the frame, the leads 4 are formed, and the terminals 1 are then formed. After the punching of the inner leads is finished, both sides of the forming position of the terminal 1 are held and punched by a punch 10. In order to form the terminals 1, they are not punched at once, but gradually punched to prevent an inner stress from occurring and the inner leads from ups and downs.
申请公布号 JPS63241957(A) 申请公布日期 1988.10.07
申请号 JP19870074114 申请日期 1987.03.30
申请人 TOSHIBA CORP 发明人 OTOMO MASAHIRO;ONO YASUO
分类号 H01L23/50 主分类号 H01L23/50
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