发明名称 OUTER PACKAGING RIM MATERIAL AND MOLDING THEREOF
摘要 PURPOSE:To provide the title material capable of being formed into a molding having a low water absorption, a low liability to undergo a dimensional change due to water absorption and an excellent appearance, by admixing a bisphenol A epoxy resin with a modified alicyclic amine, a modified alicyclic polyamine and a rubber component. CONSTITUTION:The title material is an outer packaging RIM material comprising a bisphenol A epoxy resin (A) as the main component, and admixed therewith 5-70wt.% modified alicyclic amine (B) of formula I, 5-20wt.% modified alicyclic polyamine (C) and 5-30wt.% rubber component (D) of formula II. The main component A serves to secure the mechanical strength of a molding formed from the material, while the components B and C serve to improve the impact resistance and heat resistance, respectively, of the molding. The component D serves to improve the creep characteristics as well as impact resistance of the molding. The above-mentioned components are mixed together in a mixing head and injected into a rubber or resin mold placed in a vacuum chamber, followed by molding. Thus, a molding having the above-mentioned characteristics provided by the respective components is obtd.
申请公布号 JPS63295627(A) 申请公布日期 1988.12.02
申请号 JP19870130520 申请日期 1987.05.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUETSUGU KENICHIRO
分类号 C08L63/00;C08G59/00;C08G59/50;C08L9/00 主分类号 C08L63/00
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