摘要 |
PURPOSE:To provide the title molded product whose elastic coefficient is above a specified value, and which has high rigidity and is suitable for precision machinery parts, materials used in the field of electronics, and the like, by molding a diacetylene compound comprising specific structural units. CONSTITUTION:A diacetylene compound which has as structural units one or more diacetylene group-containing hydrocarbon groups of formula I or II (wherein RI is a monovalent organic group or H; and RII, RIII and RIV are each a divalent organic group), one or more hydrocarbons having a carbon- carbon double bond, and one or more connecting groups which can connect them (e.g., an ether, ester, amino, imino or urethane linkage). As specific examples of the diacetylene compound, compounds represented by formulae III, IV, etc. can be mentioned. Then, the diacetylene compound is molded to produce the aimed molded product having a modulus elasticity of 12GPa or more.
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