| 摘要 |
PURPOSE:To prevent short-circuit at soldered parts and to shorten a time required for soldering operation for changing pitches, by optimizing a pitch between the soldered parts on a flexible substrate. CONSTITUTION:An IC socket 1 is used to a flexible substrate 2 for electrically connecting patterns 3 provided on the substrate 2. Land patterns 5 are provided at the places where the connected patterns 3 are soldered to a wiring board 4. In a jig thus constructed, a distance between pins to be connected is determined according to the dimensions of the land patterns 5. Using this jig, a pitch between the land patterns 5 is optimized so that short-circuit at the soldered parts between the land patterns is prevented effectively and that a period of time required for soldering operation for changing pitches is shortened.
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