APPARATUS FOR AUTOMATICALLY TAPING ELECTRONIC COMPONENTS

摘要

A method and apparatus for handling electronic components. The method includes: (a) advancing an elongated support member in a first direction; (b) automatically extracting electronic components from the elongated support member in a second direction while the elongated support member is advancing in the first direction, the second direction being substantially perpendicular to the first direction; and (c) placing the electronic components on an elongated first tape and applying a second tape to the first tape to fix the electronic components between the tapes. The spacing between the electronic components within the support assembly and the spacing between the electronic components fixed between the tapes may be different. A sensor may be provided to sense the presence or absence of an electronic component within the apparatus.