发明名称 PREPREG MATERIAL FOR MOLDED ARTICLE
摘要 PURPOSE:To provide the above prepreg material containing polyimide films as one or more interleaf layers placed in parallel in a state essentially free from superposition of the films in the same layer, and enabling the production of a laminated composite material having high toughness and complicated shape. CONSTITUTION:The objective prepreg material contains polyimide film tapes (preferably a tape having a width of 1-10mm, treated by corona discharge treatment and/or matte processing and having a tensile elongation at break of >=90% at room temperature) as one or more interleaf layers placed in parallel in a state essentially free from superposition of the films in the same layer. The polyimide film tapes are preferably oriented in one direction in the same layer. The thickness of the polyimide film tape is most preferably 7-30mum.
申请公布号 JPH01135841(A) 申请公布日期 1989.05.29
申请号 JP19870291891 申请日期 1987.11.20
申请人 UBE IND LTD 发明人 YAMAMOTO SHINJI;TANAKA HIDEHO;FUJII KAZUYOSHI
分类号 C08J5/24;B32B3/10;B32B27/04;B32B27/08;B32B27/12;B32B27/34;B32B27/38 主分类号 C08J5/24
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