| 摘要 |
<p>PURPOSE:To hold evenly a wafer and to decrease the coating unevenness of a resist by a method wherein, when the wafer is vacuum-chucked, the attracting surface of the wafer is vacuum-sucked through a porous member. CONSTITUTION:A disklike porous member (porous matter) 13 consisting of a porous stainless steel is arranged in a recessed part of a holding member 11 in such a way that its upper surface becomes flat. A cylindrical driving shaft 15 is connected to the central part of the lower side of the member 11 and the member 11 is coupled with this driving shaft. The hollow path 16 of the shaft 15 is coupled with a vacuum pump. A semiconductor wafer 14 is placed on the upper surface of the member 13 and is sucked and held by a vacuum chuck. A resist is fed to the central part and its vicinity of the upper surface of the wafer 14 and the shaft 15 is driven to rotate the member 11. Thereby, the wafer 14 is rotated to diffuse the resist on the whole surface of the wafer.</p> |
