| 摘要 |
PURPOSE:To remove a resist coating layer assuredly and efficiently by a method wherein a board is dipped into a treating solution used for removal of a resist coating so as to make the resist coating layer swell, and then water is spouted onto the board. CONSTITUTION:A through-hole 4 is formed on a printed wiring board 1, then copper is plated thereon, and a conductive metal layer 2, a copper plated layer 5 and a resist coating layer 6 are formed on the primary face of the board 1. Next, the board 1 is dipped into an alkyd resin anion type electrode position coating composition for the formation of a coating rein layer 7. And, the board 1 is dipped into an aqueous sodium hydroxide to make the resist coating layer 6 swell and water is spouted onto the board 1. Water is spouted onto the board 1 at the impact of 1-100g/cm<2>. |
