Method and apparatus for the application of materials
摘要
An apparatus to apply materials to a substrate disposed in a vacuum chamber is disclosed. A separate generator chamber containing an electron emitter is connected to the vacuum chamber by a process chamber so that a plasma of controllable cross-sectional shape and large area is formed and guided by magnets toward a target system. Positive ions may be accelerated against the target by applying an adjustable negative voltage.
申请公布号
US4885070(A)
申请公布日期
1989.12.05
申请号
US19880197040
申请日期
1988.05.20
申请人
LEYBOLD AKTIENGESELLSCHAFT
发明人
CAMPBELL, GREGOR A.;CONN, ROBERT W.;GOEBEL, DAN M.;ADAM, ROLF;AICHERT, HANS;BETZ, HANS;DIETRICH, ANTON;DITTMER, GONDE;HARTIG, KLAUS;HASS, FRIEDRICH;LUDWIG, RAINER;MAYR, MAX;THELEN, ALFRED