| 摘要 |
PURPOSE:To form a light-weight, small-sized, highly-dense multilayer printed board by printing a circuit pattern by copper system conductive paste on a heatproof resin film, laminating a plurality of printed circuit boards on which a circuit is formed and electrically connecting them. CONSTITUTION:A printed circuit board by the use of copper system conductive paste in which metal copper powder is dispersed in a thermosetting resin component to obtain adds prepreg 3-3'' which is an unreacted and partially reacted thermosetting resin material in which epoxy resin or resin component such as polyimide resin is impregnated in reinforcing fiber material such as glass on both the sides. It is laminated by superposing copper lining printed boards 1, 1' at the outside thereof to heat and pressurize most generally. Processing such as drilling, through hole plating, patterning and resist film forming is performed on printed circuit boards 4, 4' as well as an ordinary printed board having circuits on both sides, circuit processing of the outer face part is executed and outer face part wiring and inner layer wiring are electrically conducted to form a multilayer printed circuit. |
