RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE,申请号JP19890012638-传众专利搜索

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发明名称	RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH02192742(A)	申请公布日期	1990.07.30
申请号	JP19890012638	申请日期	1989.01.20
申请人	OKI ELECTRIC IND CO LTD	发明人	TANGE KOSUKE;OKUAKI YUTAKA
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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