| 发明名称 |
PROCESS FOR METALLIZING NON-CONDUCTIVE SUBSTRATES |
| 摘要 |
<p>Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, are treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.</p> |
| 申请公布号 |
AU601512(B2) |
申请公布日期 |
1990.09.13 |
| 申请号 |
AU19870081023 |
申请日期 |
1987.07.31 |
| 申请人 |
MACDERMID, INCORPORATED |
发明人 |
WOLF BACH;DONALD R. FERRIER;PETER E. KUKANSKIS;ANN S. WILLIAMS;MARY JANE SENECHAL |
| 分类号 |
H05K3/18;C23C18/16;C23C18/18;C23C18/20;C23C18/26;C23C18/28;C23C18/31;C23C18/38;C23C18/40;C23C18/54;H05K3/38;H05K3/42;(IPC1-7):C23C18/40 |
主分类号 |
H05K3/18 |
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