| 摘要 |
PURPOSE:To prevent direct reflection of irradiating light securing wire bonding by a method wherein multiple optical fibers are arranged between a chip and a lamp housing to be wire bonded and when chip surface is irradiated by lamp light for bonding, the irradiated quantity of light of each optical fibers is independently controlled. CONSTITUTION:A bonding arm 2 with hanging capillary 3 is free-shakingly arranged in X, Y and vertical directions on a lead frame 5 fitted with a semiconductor chip 1 while a wire 4 passing through the capillary 3 is fixed to the chip 1 and terminal of the frame 5. Besides a lamp housing 15 is provided on the frame 5 and four optical fibers 10-13 are connected to the housing 15 while an ITV camera 6 monitors the light emitted from the end of the housing 15 reaching the bonding position through the intermediary of an objective lens 7. On the other hand, a rotary shutter 18 is provided in the housing 15 to be controlled by a control circuit 19 successively cutting off the light of fibers by the stopper 18 and preventing the direct reflection of the light to the ITV camera 6. |
