FORMATION OF BUMP FOR LEAD OF SEMICONDUCTOR CHIP,申请号JP19890152515-传众专利搜索

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发明名称	FORMATION OF BUMP FOR LEAD OF SEMICONDUCTOR CHIP
摘要
申请公布号	JPH0318030(A)	申请公布日期	1991.01.25
申请号	JP19890152515	申请日期	1989.06.15
申请人	TOSHIBA CORP	发明人	SASAOKA KENJI
分类号	H01L21/60;H01L21/321	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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