ADHESIVE ON BASE OF EPOXY RESIN AND FILLER

摘要

The adhesive is composed of synthetic medium molecular epoxy resin prepared by condensation of bisphenol A with epichlorhydrin, with the content of the epoxy group of 0.25 to 0.3 mol/100 g, modified by low molecular epoxy resins containing dibutylester of phthalic acid. 45 to 80 % of this base matter is supplemented with 15 to 35 % powdered talc with grain size of up to 0.1 mm, 4 to 25 % mechanical ferrous powder with grains up to 0.125 mm and, after complete homogenisation just before application, with 4 to 6.4 % (of the total mass of the other components) diethylenetriamine for hardening. Application and hardening of this adhesive occurs at normal temperature, it is applied with a spatula and the content of mechanical ferrous powder allows adherence, without any control aids, of an optimum layer ensuring maximum firmness of the adhesive connection.