LEITERVERBINDER FUER INTEGRIERTE SCHALTUNGEN UND VERFAHREN ZU DESSEN HERSTELLUNG

摘要

A leadframe for accomplishing electrical connection to an electronic device is formed of two or more layers, each having a set of leads extending therefrom. The segments are assembled one above the other so that the leads of one set are interdigitated with the leads of the other set along the length of the leads. The effective lead spacing of the leadframe is therefore less than that for any of the segments and is less than 0.254mm in some portion of the interdigitated region. The approach is particularly useful for stamped leadframe segments, because a minimum lead spacing for any segment is determined by the stamping operation.