发明名称 LASER SOLDERING DEVICE FOR SMD-ELEMENT
摘要 PURPOSE: To avoid overheat through short-time irradiation of a high laser output by requiring an optimizing of the Z-adjustment of a laser optical system or the like and making a laser output controllable against soldering, for the purpose of performing laser soldering even on a circuit mounted with a number of components. CONSTITUTION: An equipment is employed which is provided with a temperature/ time controller, its operating part and a temperature gradient controller and which uses CW-Nd:YAG laser. In the laser head 10 of a first multi-axes robot 11 a laser output controllers 12, 13, 16 of a laser spot, face to be irradiated and soldering point are installed. A solder wire feeding device 13, which is additionally computer-controlled, is incorporated in this head 10 and its processing controllers. A second multi-axes robot 111, which is installed in addition to the first robot 11, is equipped with a device for a charging part 31, standby soldering part 32 and flux 33. Then, by using a 3-6 axes positioning device for a laser soldering process, the laser output can be controlled, and the overheat can be avoided.
申请公布号 JPH03193282(A) 申请公布日期 1991.08.23
申请号 JP19900330839 申请日期 1990.11.30
申请人 MESSERSCHMITT BOELKOW BLOHM GMBH <MBB> 发明人 DEIITERU KUNEETORERU;UERUNERU MEERERU;KAIIUUUE FUAIHINGERU
分类号 B23K26/00;B23K1/005;B23K26/03;B23K26/067;B23K26/12;B23K26/18;H05K3/34;H05K13/02;H05K13/04 主分类号 B23K26/00
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