| 摘要 |
PURPOSE:To improve mounting efficiency and to make it possible to cope with high-density mounting by forming leads on both surface of an insulating tape. CONSTITUTION:Copper foils are bonded and laminated on both surfaces of an insulating tape 11. Leads 2a and 2b are formed by etching, tin plating and the like. Two lines of protruding electrodes 3a and 3b are arranged so that they are connected between the leads 2a and 2b on a semiconductor chip 4. The lead 2a which is formed on the surface side of the semiconductor chip 4 and the protruding electrode 3a are directly bonded by thermal contact bonding as in a conventional device. The lead 2b on the opposite surface and the protruding electrode 3b are bonded with a wire 6 comprising gold (Au) or copper (Cu) by wire bonding. Potting or transfer molding is performed, and the device is sealed with a sealing body 5. |
