LIQUID COOLING DEVICE FOR AN ELECTRIC COMPONENT, IN PARTICULAR SEMICONDUCTOR COMPONENT

摘要

The electric component (11) is mounted in an electrically and thermally conducting manner on a heat sink (1) which has at least one cooling channel (2) whose wall is joined in a cavity-free manner with an electrical insulating layer (6). The ends of the cooling channel (2) have connecting means for coolant lines which are electrically insulating with respect to the heat sink (1).