发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To prevent application of a repeated stress to a bonding part of a wire and a first bonding point by providing a plurality of points of contraflexure on a track of lowering of a capillary on the occasion when the capillary is lowered toward a second bonding point after the wire is connected to the first bonding point. CONSTITUTION:After a capillary 17 being opposite to a first bonding point 13 is lowered and a wire 16 is connected to the first bonding point 13, the wire 16 is let out by an amount necessary for forming a wire loop 18, by raising the capillary 17. On the occasion when the capillary 17 is lowered toward a second bonding point 15, subsequently, first the lowering speed (in the direction Z) of the capillary 17 is made higher than the laterally shifting speed (in the direction X) thereof to a certain point (a) of lowering so that a substantially vertical track (b) of lowering is formed. Then the lowering of the capillary 17 is once stopped at the point (a) of lowering, or successively, the lowering speed (in the direction Z) of the capillary 17 from the point (a) of lowering to the second bonding point 15 is made lower than the laterally shifting speed (in the direction X) thereof so that a substantially circular-arc track (c) of lowering is formed. Moreover, the capillary 17 is lowered in the substantially vertical direction as shown by a track (d) of lowering, and the wire 16 is connected to the second bonding point 15.
申请公布号 JPH0433346(A) 申请公布日期 1992.02.04
申请号 JP19900138525 申请日期 1990.05.30
申请人 TOSHIBA CORP 发明人 ARAI HIDEKI;OTANI KAZUMI;SUEMATSU MUTSUMI
分类号 H01L21/60 主分类号 H01L21/60
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