| 摘要 |
PURPOSE:To prevent the wire breaking of a wiring layer resulting from the bore of a via hole by selectively forming a coating conductive film only in the via hole so as to fill up the bore generated in a charging conductor, and then forming a wiring layer. CONSTITUTION:A photoresist is applied on a ceramic substrate 1, and it is exposed and developed, so that only the part of the via hole 2 may surface, to form a resist film 11. By sputtering method, copper is overlaid all over the surfaces of a resist film 11 and the charging body 3 of the via hole 2 to form a conductive film 12. And by removing the resist film 11 with a solvent, the conductive film 12 on this resist film is removed, and one part of the conductive film 12 is left to fill up the bore 4 on the charging body 3 inside the via hole 2. This remaining part is the coating film 12A formed selectively. Next, a full- face sputtered conductor film 3 is formed, and it is electrically connected with the charging body 3 of the via hole 2 through the coating conductive film 12A. |
