| 摘要 |
PURPOSE:To prevent short-circuiting of wire by shaping a support bar into a specific character form so that the support bar gets over a wire-supporting protrusion. CONSTITUTION:When wire bonding is conducted between chip 2 and lead 14, a lead frame 1 is placed on a heat block 4. The central part of this heat block 4 is provided with a central recess 42, in which a stage 11 is taken in to come into contact with the heat block. The peripheral part surrounding the central recess 42 is provided with a wire-supporting protrusion 41, which juts out in the manner of escaping the stage 11 and lead 14. The bottom face of this wire- supporting protrusion 41 is almost after the shape of a gap between the stage 11 and lead 14 and its top surface is molded in such a manner that a wire 3 comes into contact with and is supported by the top surface and the loop shape of the wire 3 is not crushed. Further, a support bar 13 is shaped into an inverted U-form in the manner of getting over the wire-supporting protrusion 41. Thus, the wire-supporting protrusion can be constituted into an uninterrupted shape like a continuous bank and the bonded wire is prevented from becoming loose also in the vicinity of the support bar. |
