| 摘要 |
<p>PURPOSE:To make it unnecessary to solder each component during packaging and also enhance space efficiency by providing a package body with a coupling means which can be freely attached to and detached from a packaging portion, and each electrode of a semiconductor element which is brought into contact and connection with an external conductor. CONSTITUTION:A power MOSFET 10 having an Si bear chip 11 sealed by a sealing resin 18 is provided with a drain electrode portion 12, a ring-shaped electrode portion 13 and a source electrode portion 14 having a male thread 14a, etc., and is freely attached to and detached from a packaging portion by means of the thread 14a and the female thread member 20 of the packaging portion. By this constitution the process of soldering for packaging is made unnecessary and also space efficiency is enhanced to offer such a semiconductor device wherein components can easily be packaged and replaced.</p> |
