| 摘要 |
<p>PURPOSE:To simplify arrangement of leads in lead frame while enhancing the general-purpose properties of the lead frame by a method wherein the title semiconductor device is provided with an insulating film bonded onto a chip region excluding the wiring pad region, intermediate wirings and outer connecting leads formed on the insulating film while the pads and leads are connected through the intermediary of the intermediate wirings. CONSTITUTION:The surface of a chip 2 is coated with an insulating film 5 excluding the wiring pads 1 formed on the peripheral part of the chip 2 while intermediate wirings 6 comprising conductive films are bonded onto the insulating film 5. At this time, respective one ends of the pads 1 and the intermediate wirings 6 are wire-bonded to one another. On the other hand, the leads 3 of lead frame excluding the end parts thereof are insulated while the end parts of the leads 5 and the intermediate wirings 6 are connected to one another using a conductive bonding agent. Through these procedures, arrangement of leads in the lead frame can be simplified while enabling the versatility of the lead frame to various chips to be enhanced.</p> |
