| 摘要 |
<p>PURPOSE:To make it possible to easily cut a semiconductor substrate into dice by a method wherein a resin applied on the surface on the other side of a dicing tape is hardened and a warpage is generated on the substrate adhered on the tape by the shrinkage action of the resin. CONSTITUTION:A semiconductor substrate 10 is made to evenly bonded on an adhesive surface 12A of a dicing tape 12 and is adhered on the surface 12A. Then, a light-hardenining resin 15 is evenly applied on a position corresponding to the adhesive surface, on a non-adhesive surface 12B of the tape 12 and is hardened. The resin 15 is shrinked, a spherical surface-shaped warpage is generated on the substrate 10 adhered on the tape 12 by the shrinkage action of the resin, whereby an internal stress is generated in the substrate 10 and when a superhardness material knife 14 is pressed on the end part of the substrate 10 in parallel to specified crystal faces, linear cleavage lines (a) are easily formed. Thereby, the substrate 10 can be easily cut into dice.</p> |
