INSPECTION EQUIPMENT FOR LEAD BENDING OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE,申请号JP19900316968-传众专利搜索

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发明名称	INSPECTION EQUIPMENT FOR LEAD BENDING OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要
申请公布号	JPH04186858(A)	申请公布日期	1992.07.03
申请号	JP19900316968	申请日期	1990.11.21
申请人	NEC KYUSHU LTD	发明人	ARIMA TOSHIRO
分类号	H01L21/66;G01B11/24;G01N21/84;H01L23/50	主分类号	H01L21/66
代理机构		代理人
主权项
地址

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