发明名称 |
PROCESS FOR FORMING PASSIVATED FILM |
摘要 |
A process for a passivated film which is far reduced in the amount of gas discharge and can desorb an adsorbed gas more readily, which process comprises heating a stainless member with a surface roughness, Rmax, of 1.0.mu. m or less in an atmosphere of a mixture comprising oxygen gas and an inert gas and having a dew point of -95.degree.C or below, an impurity concentration of 10 ppb or less and an oxygen content 5ppm 25 vol% at 300 to 420 .degree.C.
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申请公布号 |
CA2100751(A1) |
申请公布日期 |
1992.08.19 |
申请号 |
CA19922100751 |
申请日期 |
1992.02.18 |
申请人 |
OSAKA SANSO KOGYO KABUSHIKI-KAISHA |
发明人 |
OHMI, TADAHIRO;NAKAHARA, YOSHIYUKI;SAKANAKA, TAKASHI;OHTA, EIJI;MIZOKAMI, SATOSHI |
分类号 |
C23C8/14;(IPC1-7):C23C8/14 |
主分类号 |
C23C8/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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