发明名称 HIGH DENSITY PLASMA DEPOSITION AND ETCHING APPARATUS
摘要 A high density ionized plasma is generated in a source chamber (10') using a single loop antenna (12') disposed in a plane that intercepts the central axis of the source chamber perpendicularly or at a lesser angle and spaced from the closed end of the chamber. With a longitudinal magnetic field and an inert or reactive gas injected into the source chamber, excitation of the antenna with RF energy in the 5 to 30 MHz establishes the M=0 excitation mode or components of both the M=0 and M=1 modes. Low frequency whistler waves are created which generate a uniform and high density plasma and high plasma current. The plasma source thus defined is used in combination with process chamber configurations in which static shaped or time modulated magnetic fields enhance the distribution and uniformity of the plasma at a substrate to be etched, deposited or sputtered.
申请公布号 WO9214258(A1) 申请公布日期 1992.08.20
申请号 WO1992US00976 申请日期 1992.02.04
申请人 PLASMA & MATERIALS TECHNOLOGIES, INC. 发明人 CAMPBELL, GREGOR, A.;CONN, ROBERT, W.;PEARSON, DAVID, C.;DECHAMBRIER, ALEXIS, P.;SHOJI, TATSUO
分类号 C23C14/34;C23C16/50;C23C16/511;C23F4/00;H01J37/32;H01L21/205;H01L21/302;H05H1/46 主分类号 C23C14/34
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