| 摘要 |
<p>PURPOSE:To prevent the operation defect of a wafer pressure member by a method wherein, at a vacuum apparatus provided with the pressure member of a sheet to be processed inside a vacuum chamber, an inert gas is supplied to the sliding and moving part at a movement rod which is attached to the pressure member and which is passed through the vacuum chamber. CONSTITUTION:When nitrogen gas is supplied to sliding and moving parts at movement rods 7 from a nitrogen-gas supply device 16 via a nitrogen-gas supply pipe 17 and a communication hole 15, the nitrogen gas flows into a vacuum chamber 1 via the sliding and moving parts at the movement rods 7. As a result, it is possible to prevent an etching reaction gas from creeping to the sliding and moving parts at the movement rods. Consequently, a reaction product does not adhere to the sliding and moving parts at the movement rods 7.</p> |
