| 摘要 |
PURPOSE:To prevent generation of a bridge phenomenon caused by excessive solder between a plurality of terminal pins disposed in a connector and land portions in soldering the terminal pins to the land portions formed at through holes with the land portions formed on the printed board after the terminal pins are inserted into the through holes. CONSTITUTION:Prior to soldering, dummy land portions 7, 7a, 7b, 7c are previously formed in positions adjacent to the final land portion in the row direction out of land portions 3 mounted on a printed board 1. Excessive solder is bonded to the dummy land portions 7, 7a, 7b, 7c. |
