发明名称 SEMICONDUCTOR PROCESSOR
摘要 PURPOSE:To peel off resin fragments with no gate residues produced on a lead frame by stepping the top face of a pallet in accordance with respective packages so that a package may incline upon pressing by a pusher. CONSTITUTION:The top face of a pallet 5 is provided with recesses 7 and steps 8 smaller than the cross width (b) of a package PK in accordance with the respective packages PK so that they incline upon pressing by a pusher 3. This makes a runner-shaped resin fragment 1 start peeling from the part of a gate 2a and then cause peeling of a frame cull 2. Therefore, even when hardened not sufficiently, the resin fragment is not cut in a vicinity of the gate because of peeling from the rapidly hardened gate 2a with the result that no gates remain on a lead frame RF upon degating.
申请公布号 JPH04298054(A) 申请公布日期 1992.10.21
申请号 JP19910063460 申请日期 1991.03.27
申请人 SONY CORP 发明人 NOMURA CHIAKI;INUDOU MASATO;KAWAMURA MASATO
分类号 B29C45/26;B29C45/38;B29L31/34;H01L21/56 主分类号 B29C45/26
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