| 摘要 |
PURPOSE:To provide an adhesive film forming device for applying a conductive adhesive to contacts of IC chips, etc., to form a stable conductive adhesive film for a long time. CONSTITUTION:This is an adhesive film forming device which has a supporting body 1 having the adhesive film formation surface coated with titanium nitride 2. Using a formation blade, a conductive adhesive film 5 is formed on the film formation surface. After that, protruding contacts 8 of an IC chip 6 are dipped in the conductive adhesive film 5 to transfer-apply a conductive adhesive to the protruding contacts 8. By coating the supporting body of the conductive adhesive film forming device with titanium nitride, a hardness, an abrasion resistance, an acid resistance and a corrosion resistance are increased and thereby the supporting body is prevented from becoming deteriorated. Therefore, a stable conductive adhesive film can be formed for a long time.
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